Power chips are connected to external circuits through product packaging, and their performance depends on the support of the packaging. In high-power circumstances, power chips are usually packaged as power components. Chip affiliation describes the electric connection on the top surface of the chip, which is typically light weight aluminum bonding cable in typical components. ^
Traditional power component package cross-section
At present, industrial silicon carbide power modules still mostly use the product packaging technology of this wire-bonded conventional silicon IGBT component. They face problems such as large high-frequency parasitic parameters, insufficient warm dissipation ability, low-temperature resistance, and inadequate insulation strength, which restrict using silicon carbide semiconductors. The display of superb performance. In order to fix these problems and totally manipulate the big prospective benefits of silicon carbide chips, several new product packaging innovations and remedies for silicon carbide power components have actually emerged in recent times.
Silicon carbide power component bonding method
(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)
Bonding products have actually created from gold cord bonding in 2001 to aluminum wire (tape) bonding in 2006, copper cord bonding in 2011, and Cu Clip bonding in 2016. Low-power gadgets have actually established from gold wires to copper cables, and the driving force is cost reduction; high-power devices have actually created from aluminum cables (strips) to Cu Clips, and the driving force is to improve product efficiency. The higher the power, the greater the needs.
Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a packaging process that makes use of a strong copper bridge soldered to solder to attach chips and pins. Compared to typical bonding product packaging approaches, Cu Clip innovation has the adhering to benefits:
1. The connection in between the chip and the pins is made of copper sheets, which, to a certain level, replaces the conventional cord bonding approach in between the chip and the pins. For that reason, an unique bundle resistance value, higher present flow, and far better thermal conductivity can be acquired.
2. The lead pin welding location does not need to be silver-plated, which can completely save the price of silver plating and bad silver plating.
3. The item appearance is completely constant with regular products and is generally made use of in servers, mobile computer systems, batteries/drives, graphics cards, motors, power materials, and various other fields.
Cu Clip has two bonding methods.
All copper sheet bonding approach
Both eviction pad and the Source pad are clip-based. This bonding technique is much more expensive and complicated, but it can accomplish better Rdson and much better thermal impacts.
( copper strip)
Copper sheet plus cable bonding technique
The resource pad makes use of a Clip approach, and the Gate utilizes a Cord approach. This bonding method is somewhat cheaper than the all-copper bonding method, saving wafer location (suitable to very little entrance locations). The process is simpler than the all-copper bonding approach and can acquire much better Rdson and better thermal impact.
Vendor of Copper Strip
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